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Organization

ShanghaiTech University
Contributors
yuyang chen
Hao Geng
Hongquan He
Xuming He
Siting Liu
Donger Luo
Kai Ma
Nan Wang
Wenhao Wang
Zhen Wang
Tao Wu
Yiwen Wu
Wenkai Yang
Jingyi Yu
Presentations
Networking
Work-in-Progress Poster
Accelerating IC Thermal Simulation Data Generation via Block Krylov and Operator Action
6:00pm - 7:00pm PDT Monday, June 23 Level 2 Lobby
Research Manuscript
EPIC: Error PredIction and Correction for Power-Efficient Voltage Underscaling Multiply-Accumulate Unit
3:30pm - 3:45pm PDT Tuesday, June 24 3003, Level 3
Design
DES4: Digital and Analog Circuits
Research Manuscript
From Flatland to Forest: Exploring Pareto-optimal Design through RTL Hierarchy Trees
5:00pm - 5:15pm PDT Tuesday, June 24 3004, Level 3
EDA
EDA1: Design Methodologies for System-on-Chip and 3D/2.5D System-in Package
Research Manuscript
LMM-IR: Large-Scale Netlist-Aware Multimodal Framework for Static IR-Drop Prediction
4:00pm - 4:15pm PDT Monday, June 23 3006, Level 3
EDA
EDA4: Power Analysis and Optimization
Research Manuscript
LVM-MO: A Large Vision Model Pioneer for Full-Chip Mask Optimization*
1:30pm - 1:45pm PDT Monday, June 23 3004, Level 3
EDA
EDA8: Design for Manufacturing and Reliability
Research Manuscript
NeuralMesh: Neural Network For FEM Mesh Generation in 2.5D/3D Chiplet Thermal Simulation
5:00pm - 5:15pm PDT Monday, June 23 3006, Level 3
EDA
EDA4: Power Analysis and Optimization
Research Manuscript
Self-Attention To Operator Learning-based 3D-IC Thermal Simulation
11:30am - 11:45am PDT Wednesday, June 25 3000, Level 3
AI
AI2: AI/ML Application and Infrastructure
Research Manuscript
Swift or Exact? Boosting Efficient Microarchitecture DSE via Multi-fidelity Partial Order Prediction
4:30pm - 4:45pm PDT Wednesday, June 25 3002, Level 3
Design
DES1: SoC, Heterogeneous, and Reconfigurable Architectures