Organization
The Chinese University of Hong Kong
Contributors
Presentations
Research Manuscript
EDA
EDA7: Physical Design and Verification
Research Manuscript
EDA
EDA7: Physical Design and Verification
Research Manuscript
Design
DES3: Emerging Models of ComputatioN
Research Manuscript
EDA
EDA5: RTL/Logic Level and High-level Synthesis
Research Manuscript
EDA
EDA8: Design for Manufacturing and Reliability
Research Manuscript
Systems
SYS5: Embedded Memory and Storage Systems
Research Manuscript
EDA
EDA1: Design Methodologies for System-on-Chip and 3D/2.5D System-in Package
Research Manuscript
EDA
EDA7: Physical Design and Verification
Networking
Work-in-Progress Poster
Research Manuscript
Design
DES1: SoC, Heterogeneous, and Reconfigurable Architectures
Late Breaking Results
Research Manuscript
AI
AI4: AI/ML System and Platform Design
Research Manuscript
EDA
EDA2: Design Verification and Validation
Research Manuscript
EDA
EDA8: Design for Manufacturing and Reliability
Research Manuscript
AI
AI2: AI/ML Application and Infrastructure
Research Manuscript
EDA
EDA5: RTL/Logic Level and High-level Synthesis
Research Manuscript
EDA
EDA8: Design for Manufacturing and Reliability
Research Manuscript
Security
SEC1: AI/ML Security/Privacy
Research Manuscript
EDA
EDA2: Design Verification and Validation
Research Manuscript
EDA
EDA5: RTL/Logic Level and High-level Synthesis
Research Manuscript
AI
AI1: AI/ML Algorithms
Research Manuscript
Swift or Exact? Boosting Efficient Microarchitecture DSE via Multi-fidelity Partial Order Prediction
4:30pm - 4:45pm PDT Wednesday, June 25 3002, Level 3Design
DES1: SoC, Heterogeneous, and Reconfigurable Architectures
Research Manuscript
Systems
SYS5: Embedded Memory and Storage Systems
Research Manuscript
AI
AI2: AI/ML Application and Infrastructure
Research Manuscript
EDA
EDA3: Timing Analysis and Optimization