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Organization

Zhejiang University
Presentations
Research Manuscript
3:30pm - 3:45pm PDT Monday, June 23 3006, Level 3
EDA
EDA4: Power Analysis and Optimization
Research Manuscript
5:15pm - 5:30pm PDT Monday, June 23 3004, Level 3
Design
DES6: Quantum Computing
Research Manuscript
4:30pm - 4:45pm PDT Monday, June 23 3001, Level 3
Design
DES5: Emerging Device and Interconnect Technologies
Research Manuscript
4:15pm - 4:30pm PDT Monday, June 23 3004, Level 3
Design
DES6: Quantum Computing
Research Manuscript
3:45pm - 4:00pm PDT Monday, June 23 3003, Level 3
Design
DES3: Emerging Models of ComputatioN
Research Manuscript
1:30pm - 1:45pm PDT Monday, June 23 3002, Level 3
Design
DES2B: In-memory and Near-memory Computing Architectures, Applications and Systems
Research Manuscript
5:00pm - 5:15pm PDT Tuesday, June 24 3004, Level 3
EDA
EDA1: Design Methodologies for System-on-Chip and 3D/2.5D System-in Package
Networking
Work-in-Progress Poster
6:00pm - 7:00pm PDT Sunday, June 22 Level 3 Lobby
Research Manuscript
5:15pm - 5:30pm PDT Wednesday, June 25 3004, Level 3
EDA
EDA2: Design Verification and Validation
Networking
Work-in-Progress Poster
6:00pm - 7:00pm PDT Monday, June 23 Level 2 Lobby
Research Manuscript
10:30am - 10:45am PDT Monday, June 23 3001, Level 3
AI
AI4: AI/ML System and Platform Design
Research Manuscript
10:30am - 10:45am PDT Tuesday, June 24 3008, Level 3
Security
SEC4: Embedded and Cross-Layer Security
Research Manuscript
4:45pm - 5:00pm PDT Tuesday, June 24 3004, Level 3
EDA
EDA1: Design Methodologies for System-on-Chip and 3D/2.5D System-in Package
Research Manuscript
2:45pm - 3:00pm PDT Tuesday, June 24 3002, Level 3
AI
AI4: AI/ML System and Platform Design
Research Manuscript
1:30pm - 1:45pm PDT Tuesday, June 24 3003, Level 3
Design
DES6: Quantum Computing
Research Manuscript
4:30pm - 4:45pm PDT Wednesday, June 25 3002, Level 3
Design
DES1: SoC, Heterogeneous, and Reconfigurable Architectures
Research Manuscript
4:00pm - 4:15pm PDT Monday, June 23 3001, Level 3
Design
DES5: Emerging Device and Interconnect Technologies