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Organization

State Key Lab of Integrated Chips and Systems, Fudan University
Presentations
Research Manuscript
3:45pm - 4:00pm PDT Tuesday, June 24 3004, Level 3
EDA
EDA1: Design Methodologies for System-on-Chip and 3D/2.5D System-in Package
Research Manuscript
1:45pm - 2:00pm PDT Monday, June 23 3001, Level 3
AI
AI3: AI/ML Architecture Design
Research Manuscript
1:30pm - 1:45pm PDT Wednesday, June 25 3001, Level 3
AI
AI3: AI/ML Architecture Design
Research Manuscript
4:15pm - 4:30pm PDT Wednesday, June 25 3001, Level 3
Design
DES2B: In-memory and Near-memory Computing Architectures, Applications and Systems