Organization
State Key Lab of Integrated Chips and Systems, Fudan University
Presentations
Research Manuscript
EDA
EDA1: Design Methodologies for System-on-Chip and 3D/2.5D System-in Package
Research Manuscript
AI
AI3: AI/ML Architecture Design
Research Manuscript
AI
AI3: AI/ML Architecture Design
Research Manuscript
Design
DES2B: In-memory and Near-memory Computing Architectures, Applications and Systems