Presentation
Intelligent Extraction of Advanced IC Package
DescriptionThe need for modern workloads in the latest innovations has brought 2.5D/3D stacking and advanced packaging technologies to the forefront. The requirements for integrating multiple chips, components, and materials to create an advanced IC package are becoming increasingly complicated and introduce new challenges to existing extraction and analysis methods. A computational framework which allows for comprehensive extraction of advanced IC package designs is proposed. It is based on a hybrid computational framework, combining different electromagnetic (EM) solvers, and leveraging AI models based on 3D full-wave simulation, to extract different netlist models efficiently and accurately for system-level analysis and optimization. It has the capability to do entire extraction of the most intricate stacked die system for a variety of packaging styles and provides co-design automation flows with signoff extraction, static timing analysis (STA) and signoff with signal and power integrity (SI/PI). With exceptional performance and reliability, it enables users to meet tight schedule efficiently.
Event Type
Exhibitor Forum
TimeTuesday, June 2410:30am - 11:00am PDT
LocationExhibitor Forum, Level 1 Exhibit Hall