Presentation
Automated platform for creating optimized 2.5D and 3D Chiplet Die-to-Die Interconnect IP Solutions for Extremely High Bandwidth Applications
DescriptionThe requirement for extremely high bandwidth chiplet interconnectivity in 2.5D and 3D packaging technologies has surged, driven by exponential growth in computing performance required for Artificial Intelligence and Machine Learning (AI/ML) applications. These new chiplet architectures have created an urgent need for high-performance, customizable die-to-die (D2D) interconnect IP solutions. This presentation explores the application of an automated analog design platform, specifically the Blue Cheetah Adaptive Interconnect Platform (AIP), to accelerate the development and optimization of D2D interconnect IP for extremely high bandwidth chiplet ecosystems. We will discuss how AIP's parameterizable generator scripts can automate the creation of layout, schematic, and simulation environments for D2D interconnect circuits. The framework's ability to encode design methodologies and leverage computer resources for iterative design and verification processes will be highlighted. We'll demonstrate how this approach can significantly reduce turnaround time from circuit design to tape-out in advanced FinFET nodes. The presentation will cover key challenges in high-bandwidth D2D interconnect design, including bandwidth density, energy efficiency, and signal integrity. Case studies will illustrate the application of AIP to create UCIe compatible D2D PHYs, showcasing quick customization for various data rates, I/O configurations, and packaging types. By demonstrating the power of automated analog design tools in creating flexible, high-performance D2D interconnect IP, this presentation aims to highlight a path forward for accelerating chiplet ecosystem development and enabling more efficient heterogeneous integration solutions for extremely high bandwidth applications.
Presenter
Event Type
Exhibitor Forum
TimeWednesday, June 2511:15am - 11:45am PDT
LocationExhibitor Forum, Level 1 Exhibit Hall