Presentation
Top 3D-IC Innovators Tackle Multiphysics Challenges in Multi-Die Silicon Design
DescriptionDesigners of multi-die 2.5D/3D-ICs have faced many new multiphysics issues that were not a concern for single-die design. These include thermal prototyping, electromagnetic coupling of digital signals, mechanical warpage of interposers, and more. This session is a moderated discussion that assembles a panel of experienced 3D-IC design engineers from leading silicon vendors to talk about their experiences with production projects. The adoption of multi-die technology is spreading to more design teams, and this is a valuable opportunity to understand what issues really matter, what lessons were learned, and which techniques that have been proven to work.
Event Type
Exhibitor Forum
TimeTuesday, June 244:15pm - 5:15pm PDT
LocationExhibitor Forum, Level 1 Exhibit Hall