Presentation
Enabling Multi-Die 3DIC Designs with AI-Powered Ecosystem Collaboration
DescriptionAs chip complexity grows, multi-die 3DIC designs are becoming a pivotal solution to meet performance and efficiency demands. This talk explores how ecosystem collaboration—spanning EDA tools, IP providers, and foundries—is leveraging AI to tackle the challenges of integration, thermal management, and design verification. Highlighting case studies, it demonstrates how AI-driven automation transforms traditionally siloed workflows into cohesive, scalable solutions, enabling faster time-to-market and innovative system designs. Attendees will gain insights into practical strategies for harnessing ecosystem synergies to address the growing demands of heterogeneous integration.
Organizers
Moderator
Event Type
Engineering Special Session
TimeMonday, June 231:30pm - 3:00pm PDT
Location2008, Level 2