Presentation
Next Generation UCIe: Enabling a Thriving Open Chiplet Ecosystem
DescriptionThe promise of an open industry standard that offers high-bandwidth, low-latency, power-efficient, cost-effective on-package connectivity between chiplets continues to evolve at blazing speed. Ever since UCIe – or Universal Chiplet Interconnect Express 1.0 was first released in March 2022, it has seen significant industry adoption. Version 1.0 was followed by Version 1.1 (Released August 2023) with key features such as runtime health monitoring for automotive and high-reliability applications. Recently, in August 2024, the latest standard, 2.0 was released.
This session aims to cover the evolution, usage and impact of UCIe through 3 different sessions: First, Dr. Das Sharma, Chair of UCIe Consortium, will provide the overview, evolution and future of UCIe. Then Dr. Zorian will delve into details of one of the key modules in UCIe: health monitoring. Finally, Mr. Jani will cover how customer usage is both benefiting from existing standards as well as driving new versions of the standard itself, highlighting its significant advancements in System-in-Package (SiP) design and paving the way for high-density systems with improved performance and reduced power consumption.
This session aims to cover the evolution, usage and impact of UCIe through 3 different sessions: First, Dr. Das Sharma, Chair of UCIe Consortium, will provide the overview, evolution and future of UCIe. Then Dr. Zorian will delve into details of one of the key modules in UCIe: health monitoring. Finally, Mr. Jani will cover how customer usage is both benefiting from existing standards as well as driving new versions of the standard itself, highlighting its significant advancements in System-in-Package (SiP) design and paving the way for high-density systems with improved performance and reduced power consumption.
Organizer
Moderator
Event Type
Engineering Special Session
TimeMonday, June 2310:30am - 12:00pm PDT
Location2012, Level 2
Front-End Design
Chiplet
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