Presentation
IC Folding for Enhanced Performance in Homogeneous RF-AMS Systems
DescriptionThree-dimensional (3D) ICs have transitioned from academic research to commercial production, primarily driven by advancements in memory technologies. However, the integration of 3D architectures within the realm of analog and mixed-signal (AMS) circuits presents unique challenges. A critical analysis of current Electronic Design Automation (EDA) tools and packaging technologies reveals significant limitations in effectively designing and manufacturing complex 3D AMS systems. These limitations become particularly pronounced in applications demanding high-frequency performance, such as radio frequency (RF) circuits, where the integration of multiple layers of homogeneous materials is essential.
This presentation showcases a cutting-edge 3D RF design solution, powered by our innovative IC Folding technology. Specifically tailored for leading-edge foundry RF processes, this solution addresses the critical challenges of 3D AMS integration. By leveraging these advanced tools, we enable the optimization of high-performance, power-efficient RF systems. Our technology has achieved area reduction in chip size by 35-40%, making it a unique value proposition to our customers.
This presentation showcases a cutting-edge 3D RF design solution, powered by our innovative IC Folding technology. Specifically tailored for leading-edge foundry RF processes, this solution addresses the critical challenges of 3D AMS integration. By leveraging these advanced tools, we enable the optimization of high-performance, power-efficient RF systems. Our technology has achieved area reduction in chip size by 35-40%, making it a unique value proposition to our customers.
Event Type
Engineering Poster
TimeTuesday, June 245:00pm - 6:00pm PDT
LocationEngineering Posters, Level 2 Exhibit Hall