Presentation
A Comprehensive Electromagnetic Analysis Flow for Die and Package Joint Model Simulation of RF Chips Design
DescriptionThis post reports an high effiency and precision flow of EM Analysis for die and package joint modeling simulation of RF chips design realizing on simulation of one outout maching balun merging with according package. In this fllow we combine the transformer and ground/power line mental on chip with package model. By using this method, we built the comprehensive EM model to get the scatter parameters of the model, in which we can correct the ignorance of the coupled capacitors and the wrong electric field around the bonding surface and we avoid extra ports at the inter terminals between die and packge or between main circuit and ground or power nets and their additional parasitic Inductors. By using proposed new method flow, we can reduce the half of the ports and get a more brief EM model. The simulation result shows an repairation of the error of the input port resistance and Inductance exceeds 15% around the mesh frequency of 5GHz and correction of the abnormal spur in insert loss at 29.3GHz.
Event Type
Engineering Poster
TimeTuesday, June 245:00pm - 6:00pm PDT
LocationEngineering Posters, Level 2 Exhibit Hall