Presentation
3DIC Thermal-Aware Early Design Optimization
Description3DIC technology nowadays unveil a new avenue for expanding the design capacity and integration density. It is beneficial for faster performance, lower power consumption, miniaturization and lower cost etc. Nevertheless, it comes with new challenges that need to be addressed to make the 3DIC solutions successful. Multiphysics effect is one of the critical challenges, especially for the thermal dissipation. Various technologies aim to resolve thermal issues at late design stage, but it could be very time-consuming to converge fatal thermal issues. However, most commercial EDA tools do not support thermal-aware design planning at early design stage. This paper presents a thermal-aware design optimization methodology to resolve thermal issues at early design stage. We proposed to create thermal constraints at early P&R stage, and the constraints guide module floorplanning of early design optimization. Verify and fix the thermal constraints violations iteratively at P&R stage without thermal simulation quickly converge the thermal impact and module floorplanning. The solution models the thermal impact for early design optimization and shorten the design cycle between implementation and thermal verification.
Event Type
Engineering Presentation
TimeTuesday, June 244:00pm - 4:15pm PDT
Location2012, Level 2
Back-End Design
Chiplet