Presentation
SuperCoverage: AI-Guided Full Coverage of Thermal and Power Analysis for SoC Design
DescriptionTransient temperature response approximately follows an exponential function of power density. As transistors keep shrinking due to Moore's Law turbo workloads in client processors are experiencing increased localized power density – resulting in increased transient temperature ramp rates and large workload dependent on die thermal gradients. Each workload exhibits unique thermal response characteristics, and the variety and volume of workloads are vast and continuously growing. Accurate measurement of actual hot-spot temperatures is crucial for effective processor dynamic power and thermal control, as well as ensuring thermal reliability. To address this challenge, we propose SuperCoverage, a novel approach that significantly enhances workload coverage for power and thermal analysis by a factor of 100x while drastically accelerating the generation of power and thermal maps by a factor of 1000x.
Event Type
Engineering Presentation
TimeMonday, June 234:00pm - 4:15pm PDT
Location2008, Level 2
AI
Systems and Software
Chiplet