Presentation
Advanced Verification Solutions for Communication ICs to Ensure High Quality Amid PVT Variations
DescriptionTHine Electronics specializes in designing high-speed interfaces and timing controllers. Their newly developed IC features 8-bit x 8 phase interpolators, designed for high-speed IO interfaces and communication systems. To ensure the quality of this design, THine's design flow demands SPICE-accurate verification across a wide range of scenarios, including 64 process modes, multiple temperature and supply voltage values, and hundreds of phase interpolator settings. This results in tens of thousands of nominal corners, requiring a significant number of samples for achieving 4-sigma statistical accuracy. Traditional methods would need at least 10 million samples for verification.
To meet their verification goals within practical production timelines, THine Electronics utilized an AI-driven methodology incorporating Siemens' Solido Simulation Suite and Solido Design Environment. This approach allowed the design team to secure SPICE-accurate verification at 4-sigma with only thousands of samples, reducing the total verification cycle by 100x in terms of simulation numbers compared to conventional brute-force methods.
In this presentation, we will explore the complex verification challenges encountered, the methodology used to overcome them, and the achieved results, highlighting how the collaboration between THine Electronics and Siemens EDA leveraged an AI-powered design verification flow to achieve accurate results with remarkable efficiency gains.
To meet their verification goals within practical production timelines, THine Electronics utilized an AI-driven methodology incorporating Siemens' Solido Simulation Suite and Solido Design Environment. This approach allowed the design team to secure SPICE-accurate verification at 4-sigma with only thousands of samples, reducing the total verification cycle by 100x in terms of simulation numbers compared to conventional brute-force methods.
In this presentation, we will explore the complex verification challenges encountered, the methodology used to overcome them, and the achieved results, highlighting how the collaboration between THine Electronics and Siemens EDA leveraged an AI-powered design verification flow to achieve accurate results with remarkable efficiency gains.
Event Type
Engineering Presentation
TimeMonday, June 2311:45am - 12:00pm PDT
Location2010, Level 2
AI
IP