Presentation
Analysis of Electrostatic Discharge (ESD) for 3DIC systems
DescriptionElectrostatic Discharge (ESD) poses new challenges in multi-die (2.5D and 3D) systems. Traditional ESD analysis focuses on single-die systems, but multi-die systems introduce new discharge paths from die-to-die, necessitating a comprehensive assessment through simulation. This study applies well-established ESD simulation methodologies to the entire multi-die system, including package and interposer, using novel simulation tools. This approach involves Current Density (CD) and Resistance (R) checks to identify potential violations that single-die analysis might miss. The findings highlight the importance of assessing ESD vulnerability in 3DIC systems to ensure their safety and reliability, and may be critical to signing off on designs before production going forward.
Event Type
Engineering Presentation
TimeMonday, June 234:15pm - 4:30pm PDT
Location2008, Level 2
AI
Systems and Software
Chiplet