Presentation
Accurate Thermal Simulation of 3DIC Package with Co-Packaged Optics
DescriptionCo-packaged optics (CPO) is a promising candidate for implementing low-power, high-bandwidth optical links in datacenters and in high-performance computing (HPC) systems. By bringing the optical transceiver into the 3DIC package, CPO can reduce the complexity and power loss of the overall system. These benefits come at the cost of increased thermal power density in the 3DIC from the tighter integration. The close proximity of the electrical integrated circuit (EIC) and the photonic integrated circuit (PIC) also results in thermal cross-talk through vertical die-to-die coupling. Accurate thermal simulation of the 3DIC package is needed to ensure thermal integrity of the package and to reduce performance degradation from thermal crosstalk. In this work, we demonstrate a highly efficient and accurate chip-centric thermal simulation workflow for CPO. By generating chip thermal models (CTMs) for the EIC and PIC, we enable efficient thermal simulation of the 3DIC package to profile the high-fidelity temperature distribution of all dies. We extend the traditional CTM for modelling the PIC which increases the overall accuracy of our simulation. The temperature map is imported into a photonic circuit simulator to capture the effects of thermal crosstalk from the package on the performance of the PIC.
Event Type
Engineering Presentation
TimeMonday, June 234:30pm - 4:45pm PDT
Location2008, Level 2