Presentation
High Performance Extraction of 2.5D/3D-IC Package
DescriptionThe need for modern workloads in the latest innovations has brought 2.5D/3D stacking and advanced IC packaging technologies to the forefront. The requirements for integrating multiple chips, components, and materials to create an advanced IC package are becoming increasingly complicated and introduce new challenges to existing extraction and analysis methods. Fast and accurate extraction and analysis methods are increasingly critical for complex advanced IC package design. We developed a hybrid computational electromagnetic framework, utilizing different basic electromagnetic methods for modeling different parts of the package, and leveraging the machine learning models that greatly simplified the extraction complexity, to extract advanced IC packages efficiently and accurately. It has the capability to do the extraction of entire IC package within reasonably short time frames. It can generate various netlists models with standard die to package, and to board mapping headers, for system-level analysis and validation. With high efficiency and reliability, the developed solver helps designers to meet compressed schedules of IC package design.
Event Type
Engineering Presentation
TimeMonday, June 234:45pm - 5:00pm PDT
Location2008, Level 2