Presentation
Beyond Limits: Packaging, Cryogenic, and New Cooling Strategies for Future Computing
DescriptionAs computing systems push toward ever-increasing performance, thermal management becomes a fundamental bottleneck. Cooling is no longer just a support function—it is a necessity to ensure that modern and future computing architectures achieve their full potential. The question remains: what is the best approach to keep computing efficient while overcoming thermal constraints? Should we rely on conventional package-level cooling, embed advanced and exotic cooling solutions within the 3D stack itself, or shift our focus toward developing thermally resilient devices that can operate at much higher temperatures? This panel will explore these three primary thermal management strategies. We will bring together experts from semiconductor manufacturing, system architecture, and thermal engineering to debate the merits, feasibility, and trade-offs of each approach. While cryogenic cooling remains an interesting avenue, the discussion will focus on the dominant and most practical cooling methods that can be broadly applied to computing systems today.
Event Type
Research Panel
TimeTuesday, June 2410:30am - 12:00pm PDT
Location3012, Level 3