Presentation
Analytical Warpage-aware Multi-die Floorplanning for Advanced Package Designs
DescriptionThe difference in coefficients of thermal expansion between materials leads to uneven deformation within a package, known as warpage. This warpage effect has become a significant reliability concern in advanced packaging, and effective methods are still desirable. We present the first analytical multi-die floorplanning framework considering the warpage effect in advanced package designs. We apply a physical warpage model that can be embedded into a gradient-based floorplanner to optimize the warpage effect. We then present a warpage, wirelength, and area co-optimizer considering the overlapped region and outline barrier constraints. Experimental results show that our floorplanner outperforms TCG-based ones in warpage, wirelength, and area.
Event Type
Networking
Work-in-Progress Poster
TimeMonday, June 236:00pm - 7:00pm PDT
LocationLevel 2 Lobby