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Process Design Kits for Co-Designing Broadband Integrated Photonics and Silicon CMOS in Electronic-Photonic VLSI Circuits
DescriptionElectronic-Photonic Integrated Circuits (EPICs) are evolving rapidly for high performance communication, computation, imaging, and more. However, optimizing performance for EPICs is challenging due to the separate tools used for designing photonic and electronic components, while the interconnect between the two often limits the overall EPIC performance. Thus, co-designing, simulating, and verifing electronics, photonics, and their interconnect together, in a unified design environment is essential.
To address this, we present Process Design Kits (PDKs) for co-designing electronics, photonics, and interconnect parasitics using industry-standard VLSI design flows. Key characteristics of our PDKs include:
(1) SPICE-compatible compact models for photonic devices, enabling circuit simulations for ICs comprising both electronic and photonic devices as well as their interconnection.
(2) Techniques to account for broad optical spectrums and non-linear interactions between wavelengths, e.g., non-linear optical processes in semiconductor optical amplifiers and second harmonic generation.
(3) Physical design and verification, with parameterized cells for layouts, and tools for automatic Design Rule Check (DRC) and Layout vs. Schematic (LVS).
We demonstrate the effectiveness of our PDKs with detailed physical designs and simulations for applications including: (a) high-speed optical datalinks leveraging resonators to implement wavelength-division multiplexing (WDM); and (b) high-bandwidth computation kernels for matrix multiplication in the optical domain.
Event Type
Networking
Work-in-Progress Poster
TimeMonday, June 236:00pm - 7:00pm PDT
LocationLevel 2 Lobby