Presentation
AI-enabled Efficient Extraction of Entire Advanced IC Package
DescriptionThe need for modern workloads in the latest innovations has brought 2.5D/3D stacking and advanced packaging technologies to the forefront. The requirements for integrating multiple chips, components, and materials to create an advanced IC package are becoming increasingly complicated and introduce new challenges to existing extraction and analysis methods. This paper presents a computational framework which allows for comprehensive extraction of advanced IC package designs. It is based on a hybrid computational framework, combining different electromagnetic (EM) solvers, and leveraging AI models and on-the-fly libraries based on 3D full-wave simulation, to extract different netlist models efficiently and accurately for system-level analysis and optimization. It has the capability to do entire extraction of the most intricate stacked die system for a variety of packaging styles and provides co-design automation flows with signoff extraction, static timing analysis (STA) and signoff with signal and power integrity (SI/PI). With exceptional performance and reliability, it enables users to meet tight schedule efficiently.
Event Type
Networking
Work-in-Progress Poster
TimeSunday, June 226:00pm - 7:00pm PDT
LocationLevel 3 Lobby