Presentation
Advanced Packaging: Promise and the Needs
DescriptionAs cost-effectiveness of transistor scaling according to Moore's law slows, increasingly, future electronic systems for computing, mobile communications, automotive, defense and biological applications will rely on advanced integration of separately manufactured chiplets into a 2.5D/3D System-in-Package (SiP). Advanced Packaging with its promise of decreased cost through higher manufacturing yield, chiplet node optimization, functional modularity, and chiplets reuse will be a requisite foundation of future system design. Recently, sophisticated examples of advanced packages containing nearly 50 dies, many fabricated by different vendors on different technological nodes, have been demonstrated. In general, 2.5D integration of many dies on a common substrate, or their complex 3D integration is challenged by many factors including custom designs and tools with limited availability, computationally expensive multiscale and multiphysics models that make design exploration inefficient, unavailability of high-density substrates,
inefficient power delivery and thermal management solutions, as well as assembly, testing and reliability challenges. In this talk, I will provide a broad overview of Advanced Packaging and the ongoing roadmapping efforts at identifying its needs.
inefficient power delivery and thermal management solutions, as well as assembly, testing and reliability challenges. In this talk, I will provide a broad overview of Advanced Packaging and the ongoing roadmapping efforts at identifying its needs.
Event Type
Research Special Session
TimeTuesday, June 244:00pm - 4:30pm PDT
Location3010, Level 3