Presentation
EDA for Heterogeneous Integration
DescriptionThis talk will discuss the requirements for EDA tooling for heterogeneous integration (HI). Specific issues that will be addressed include (1) chiplet disaggregation, to map the design on to smaller chiplets, working in conjunction with systemtechnology co-optimization to determine the right substrate and chiplet technologies; (2) multiphysics analysis that incorporates thermomechanical aspects into performance analysis; (3) physical design of chiplets on the substrate, including the design of thermal solutions and power delivery solutions; and (4) the underlying infrastructure required to facilitate HI-based design, including the design and characterization of chiplet libraries. Given the complexities of these tasks, the talk will discuss the role of analysis and optimization at various stages of design, ranging from fast machine-learning-driven analyses in early stages to signoff-quality analysis.
Event Type
Research Special Session
TimeTuesday, June 245:00pm - 5:30pm PDT
Location3010, Level 3