Presentation
Materials-Device-Systems Co-optimization using AI/ML
DescriptionExponential progress in Artificial Intelligence (AI) owes much to remarkable advancements in semiconductor technology. The semiconductor roadmap is guided by the PPACt metrics: low Power, high Performance, reduced Area, low Cost, and rapid time to market. Typically, it involves years or even decades of meticulous refinement of semiconductor innovations traversing from Concept & Feasibility (CnF) stage to High Volume Manufacturing (HVM). This multifaceted endeavor is a sequence of four key steps - Materials discovery, Process optimization, Device engineering and Chip design. In this tutorial, we will explore transformative shifts in semiconductor industry driven by cutting edge AI/Machine Learning (ML) methodologies which can accelerate PPACt.
Event Type
Research Special Session
TimeMonday, June 233:30pm - 4:00pm PDT
Location3010, Level 3