Presentation
AMD InstinctTM MI300 Series Accelerator: Engineering Showcase of Heterogeneous Integration Technologies
DescriptionCompute requirements for machine learning (ML) models for AI training and inference applications are driving the AI supercycle. Heterogeneous integration via chiplet architectures is key to enabling economically feasible growth of power-efficient computing, particularly given the slowdown in Moore's law. AMD Instinct™ MI300 Series accelerators leverage multiple advanced packaging technologies to provide a heterogeneous integration solution for emerging AI/ML and high-performance computing (HPC) workloads.
In this presentation, we will highlight innovative advanced packaging technologies that directly enable the heterogeneous integration of multiple chiplets for AMD Instinct™ MI300. These technologies include microbump 3D memory stacks, 2.5D silicon interposers, and 3D hybrid bonding. The combination of these advanced packaging techniques facilitates architectural innovations and delivers generational performance uplifts that traditional technologies and Moore's Law scaling alone cannot achieve.
In this presentation, we will highlight innovative advanced packaging technologies that directly enable the heterogeneous integration of multiple chiplets for AMD Instinct™ MI300. These technologies include microbump 3D memory stacks, 2.5D silicon interposers, and 3D hybrid bonding. The combination of these advanced packaging techniques facilitates architectural innovations and delivers generational performance uplifts that traditional technologies and Moore's Law scaling alone cannot achieve.
Event Type
Research Special Session
TimeTuesday, June 244:30pm - 5:00pm PDT
Location3010, Level 3