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Presenter

Zhiqiang Li
Institute of Microelectronics, Chinese Academy of Sciences
Presentations
Networking
Work-in-Progress Poster
Self-Supervised Learning based Etching Process Modeling: Bridging Simulation and Experimental Data
6:00pm - 7:00pm PDT Monday, June 23 Level 2 Lobby
DES5: Emerging Device and Interconnect Technologies
Research Manuscript
ChipletEM: Physics-Based 2.5D and 3D Chiplet Integration Electromigration Signoff Tool Using Coupled Stress and Thermal Simulation
11:45am - 12:00pm PDT Wednesday, June 25 3003, Level 3
EDA
EDA8: Design for Manufacturing and Reliability