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Presenter

Jungyun Choi
Samsung
Presentations
Research Manuscript
Accelerating design-technology co-development using neural compact modeling and data-driven SPICE simulation
11:45am - 12:00pm PDT Wednesday, June 25 3000, Level 3
AI
AI2: AI/ML Application and Infrastructure
Engineering Presentation
IR Drop-Aware PDN Design Methodology for HBM Proxy Package Si-Interposer with 3D-IC Platform
1:30pm - 1:45pm PDT Monday, June 23 2012, Level 2
AI
Back-End Design
Chiplet
Engineering Presentation
Scenario-based Mixed Signal Layout Generator using Generation APIs for Memory
3:30pm - 3:45pm PDT Monday, June 23 2010, Level 2
IP