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Presenter

Nikhil Jayakumar
Amazon
Presentations
Engineering Poster
Networking
Hierarchical EM-IR Signoff Methodology for large SoCs integrated in 2.5DIC Structures
5:00pm - 6:00pm PDT Monday, June 23 Engineering Posters, Level 2 Exhibit Hall
Engineering Poster
Networking
Chip package level thermal integrity analysis of high-power data center chips for hot spot detection
5:00pm - 6:00pm PDT Monday, June 23 Engineering Posters, Level 2 Exhibit Hall