Presenter Full Program · Contributors · Organizations · Search Program · Flagged · Happening NowMore…Search ProgramFlaggedHappening NowMing-Chuan HuIntel CorporationPresentationsNetworkingWork-in-Progress PosterA Novel Power-gradient-aware Cell Placement Methodology Considering 3D-IC Stacking Thermal Boundary to Achieve Timing and Thermal Co-optimization6:00pm - 7:00pm PDT Monday, June 23 Level 2 LobbyDES5: Emerging Device and Interconnect Technologies
