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Presenter

Wei Xing
University of Sheffield
Presentations
Research Manuscript
Multi-Agent Yield Analysis For Circuit Design
11:00am - 11:15am PDT Wednesday, June 25 3003, Level 3
EDA
EDA8: Design for Manufacturing and Reliability
Research Manuscript
Self-Attention To Operator Learning-based 3D-IC Thermal Simulation
11:30am - 11:45am PDT Wednesday, June 25 3000, Level 3
AI
AI2: AI/ML Application and Infrastructure
Research Manuscript
NeuralMesh: Neural Network For FEM Mesh Generation in 2.5D/3D Chiplet Thermal Simulation
5:00pm - 5:15pm PDT Monday, June 23 3006, Level 3
EDA
EDA4: Power Analysis and Optimization
Research Manuscript
Accuracy Is Not Always We Need: Precision-aware Bayesian Yield Optimization
2:30pm - 2:45pm PDT Monday, June 23 3004, Level 3
EDA
EDA8: Design for Manufacturing and Reliability