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Presenter

Lang Lin
Ansys
Presentations
Engineering Presentation
A Hybrid Simulation Technique for High-Speed and Accurate System-Level Side-Channel Leakage Analysis
3:30pm - 3:48pm PDT Tuesday, June 24 2012, Level 2
Back-End Design
Chiplet
Engineering Presentation
Balancing Performance and Side-Channel Resilience in a Lightweight ECC Cryptosystem
10:30am - 10:45am PDT Wednesday, June 25 2010, Level 2
IP
Engineering Presentation
Accurate Thermal Simulation of 3DIC Package with Co-Packaged Optics
4:30pm - 4:45pm PDT Monday, June 23 2008, Level 2
AI
Systems and Software
Chiplet