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Presenter

Lalitha Immaneni
Intel Corporation
Presentations
Research Special Session
Advanced Package Design & System Co-Optimization for Heterogeneous Integration
3:30pm - 4:00pm PDT Tuesday, June 24 3010, Level 3
Design
Engineering Special Session
Enabling Multi-Die 3DIC Designs with AI-Powered Ecosystem Collaboration
1:30pm - 3:00pm PDT Monday, June 23 2008, Level 2
AI
Back-End Design
Chiplet