Close

Presenter

Yao-Wen Chang
National Taiwan University
Presentations
Networking
Work-in-Progress Poster
Analytical Warpage-aware Multi-die Floorplanning for Advanced Package Designs
6:00pm - 7:00pm PDT Monday, June 23 Level 2 Lobby
Research Manuscript
Constraint Graph-based PCB Legalization Considering Dense, Heterogeneous, Irregular-Shaped, and Any-Oriented Components
10:45am - 11:00am PDT Tuesday, June 24 3004, Level 3
EDA
EDA7: Physical Design and Verification
Late Breaking Results
Late Breaking Results: Advanced PCB Placement with Irregular Components for Efficient Collision Detection and Routability Optimization
6:00pm - 7:00pm PDT Monday, June 23 Level 2 Lobby
Late Breaking Results
Late Breaking Results: Multi-Objective Multi-Bit Flip-Flop Placement Considering Pre-Placed Cells
6:00pm - 7:00pm PDT Monday, June 23 Level 2 Lobby
Research Manuscript
Clearance-Constrained PCB Global Placement with Heterogeneous Components
10:30am - 10:45am PDT Tuesday, June 24 3004, Level 3
EDA
EDA7: Physical Design and Verification
Late Breaking Results
Late Breaking Results: Scalable GPU-Friendly Parallelization for Sweep-Based Maze Routing
6:00pm - 7:00pm PDT Monday, June 23 Level 2 Lobby
Late Breaking Results
Late Breaking Results: Warpage-Aware Generative Floorplanning for Reliable Advanced Packaging
6:00pm - 7:00pm PDT Monday, June 23 Level 2 Lobby