Presenter
Wenbo Yin
Presentations
Research Manuscript
AI
AI4: AI/ML System and Platform Design
Research Manuscript
EDA
EDA1: Design Methodologies for System-on-Chip and 3D/2.5D System-in Package
2:15pm - 2:30pm PDT Tuesday, June 24 3002, Level 3
3:45pm - 4:00pm PDT Tuesday, June 24 3004, Level 3