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Research Manuscript: Watts Up? AI/ML Enabled Advances in Power and Thermal Integrity
DescriptionRising energy levels in modern chipsets due to larger computing workloads challenge the chip power integrity and have necessitated an efficient power analysis and a deeper exploration of methodologies to lower the overall power utilization. In light of these developments, this session presents novel techniques to estimate various attributes including IR drops, power-delivery networks, Place and Route, thermal analysis, and architectural enhancements. Furthermore, these works utilize novel AI/ML modeling and design automation approaches to optimize the design and EDA flow.



Event TypeResearch Manuscript
TimeMonday, June 233:30pm - 5:30pm PDT
Location3006, Level 3
Topics
EDA
Tracks
EDA4: Power Analysis and Optimization