Session
Materials to Systems Design Automation for Advanced Chips
Session Chair
DescriptionWe present four talks which delve into the entire semiconductor innovation process, from materials discovery to system-level design automation. It highlights how AI/ML methodologies and advanced simulation platforms can accelerate each step, addressing the complexities of modern semiconductor design. The discussion of high-bandwidth photonic interconnects, thermal-stress simulations and comprehensive EDA platforms underscore the transformative potential of integrating AI/ML into the semiconductor design workflow, ultimately leading to more efficient and powerful advanced chips.
Event TypeResearch Special Session
TimeMonday, June 233:30pm - 5:30pm PDT
Location3010, Level 3
Design
Presentations
| 3:30pm - 4:00pm PDT | Materials-Device-Systems Co-optimization using AI/ML | |
| 4:00pm - 4:30pm PDT | Scalable Heterogenous Photonic Systems with Design Automation | |
| 4:30pm - 5:00pm PDT | Multi-Scale Thermal-Mechanical Modeling of Advanced Chips | |
| 5:00pm - 5:30pm PDT | Enhancing Design Automation with AI and Quantum Algorithms for Chip Design |