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Session

Engineering Poster: Tuesday Engineering Tracks Poster Reception
Event TypeEngineering Poster
TimeTuesday, June 245:00pm - 6:00pm PDT
LocationEngineering Posters, Level 2 Exhibit Hall
Presentations
Scalable Debugging for Data Centers: Ensuring Reliability from Design to Operations
Guided Physical Power Optimization of AI Silicon
AI-Based Trimming and Optimization for Voltage Regulators: Proven Accuracy with Wafer Data
A Comprehensive Electromagnetic Analysis Flow for Die and Package Joint Model Simulation of RF Chips Design
Automated Topology based Pin Access Checker for Correct by Construction Standard Cells Design
Power-aware DFT-driven High Confidence EMIR Signoff for Low Power Automotive SoCs
Physical Design Independent-IR solver for early first cut SoC PG analysis
Soft Error Simulation Tools, From 45nm to 3nm
Physical Aware RAM Sequential ATPG for IR Prevention
Accelerated ESD Sign-Off Solution: An Efficient and Scalable Approach
Innovative RDL PEX flow with Calibre, enhances design reliability and performance
Pattern-based Abstraction for Mixed Transistor-Level Static Timing Analysis
Effective Ways of Analyzing and Optimizing Voltage Variation Challenges for 3DIC Chips
Novel Shift-Left Methodology for System Power Integrity Analysis with Early Chip Power Model
Formal meets Simulation: Accelerate Verification closure using Multiplatform technologies
1.1% Die area reduction in Consumer and Industrial MCU-Production SoC meeting Analog Routing and performance Targets
USB4 MAC Verification: Overcoming Serial Interface and Simulation Time Challenges
A Robust and Efficient Verification Suite for AMS IP HDL Models for Streamlined SoC Integration
Detection of Functional and Current Related Bugs in SoC through Full Chip SPICE Simulations (FCS)
An Efficient Hierarchical Chip-Top Level EMIR Signoff Methodology for Large Automotive SOCs.
Recipe Explorer: Crafting the Missing PD Flow Layer
Timing Visualizer AI Assistant: A Novel Machine Learning Application for Efficient Timing Triage
ENZO: Comprehensive DFT Methodology for MCU class of devices
Advanced State Space Tunneling: Debug Your Formal Complexity Using Waveforms!
Maximizing IR sign-off coverage using Sigma-AV and its benefit on PPA
Automated QA for Standard Cell Libraries used in RAIN RFID Chips
Janus – twin-faced debugging - Anecdotes from formal, security & timing exception verification
Portfolio Re-characterization using AI
AI-ML meets SPICE to achieve 6-sigma Accuracy: A Revolution in Statistical Analysis
Accurate Memory IR Sign-Off at Lower Tech nodes
Accelerating Semiconductor Test Data Analysis through CPU-GPU Hybrid Computing: A Resource Optimization Framework
IC Folding for Enhanced Performance in Homogeneous RF-AMS Systems
Design Quality Improvement Through Automation
Audit Flow: A fast quality checker tool for early design convergence
Simulation-Aware Gate Resistance Modeling before Post-Layout Simulation
Chip reliability with antenna discharge path consideration
Approach For Quality DV Using C2RTL For Algorithmic Designs Authors: Neema Agarwal, Himanshu Chauhan, Harsh Setia, Atharva Mahesh Kakde, Ketki Gosavi
CTS with Machine Learning NDR
Efficient Translation of OpenAccess Design Data to the OASIS® Format
18% Die area reduction in UWB Automotive Production SoC meeting performance
Automated – BUS Routing Solution for Efficient DRC clean TestChip Design
Peak Power Optimization in RTL2GDS flow using guidance from RTL Power Optimization tools
A Novel Solution for Parasitic resistance analysis: Calibre PERC-Driven Optimization for PEX Quality Assurance
Validation journey of SOC High Speed Interfaces: From sim to real device
Front-End Design