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DTSTAMP:20260402T024532Z
LOCATION:3006\, Level 3
DTSTART;TZID=America/Los_Angeles:20250625T140000
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UID:dac_DAC 2025_sess143_RESEARCH1357@linklings.com
SUMMARY:GNN-MLS: Signal Routing in Mixed-Node 3D ICs through GNN-Assisted 
 Metal Layer Sharing
DESCRIPTION:Jiawei Hu (Georgia Institute of Technology), Pruek Vanna-iampi
 kul (Burapha University), Zhen Zhuang and Tsung-Yi Ho (The Chinese Univers
 ity of Hong Kong), and Sung Kyu Lim (Georgia Institute of Technology)\n\nN
 ative 3D IC design promises commercially viable chips with improved perfor
 mance and density. While pseudo-3D flows achieve manufacturability, they f
 all short of full 3D optimization due to reliance on 2D EDA tools, limitin
 g cross-tier optimization. Metal Layer Sharing (MLS) offers a solution by 
 enabling cross-tier routing but introduces two challenges: timing degradat
 ion from indiscriminate MLS and testability issues in hybrid-bonded 3D ICs
 . We propose GNN-MLS, a GNN-assisted framework for targeted cross-tier net
  optimization through MLS to improve timing globally, alongside a tailored
  design-for-test (DFT) solution to ensure robust testability with minimal 
 power overhead. Experimental results show GNN-MLS reduces timing violation
 s by up to 79% and improves WNS by 81% and TNS by 94%, advancing pseudo-3D
  flows toward fully optimized, commercially viable 3D ICs.\n\nTopics: EDA\
 n\nTracks: EDA7: Physical Design and Verification\n\nSession Chairs: Igor 
 Markov (Synopsys) and David Chinnery (Siemens)\n\n
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