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DTSTAMP:20260402T024534Z
LOCATION:3003\, Level 3
DTSTART;TZID=America/Los_Angeles:20250625T114500
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UID:dac_DAC 2025_sess146_RESEARCH273@linklings.com
SUMMARY:ChipletEM: Physics-Based 2.5D and 3D Chiplet Integration Electromi
 gration Signoff Tool Using Coupled Stress and Thermal Simulation
DESCRIPTION:Zeyu Sun, Weijie Tong, Xiaoning Ma, He Cao, Jianyun Liu, Zhiqi
 ang Li, and Qinzhi Xu (Institute of Microelectronics, Chinese Academy of S
 ciences)\n\nElectromigration (EM) has become one of the major challenges f
 or\n2.5D and 3D chiplet integration systems. However, most of the re-\nsea
 rch for EM focus on 2D power delivery network and cannot take\nthe vertica
 l power supply structures and non-uniformly thermal\ndistribution conditio
 n between dies into consideration. To mitigate\nthis problem, in this arti
 cle a novel EM simulation tool ChipletEM\nfor 2.5D and 3D chiplet integrat
 ion systems is proposed. A finite vol-\nume method (FVM) based electrical-
 thermal co-simulation model\nis employed to get initial temperature and cu
 rrent density inside\nTSV. A finite difference time domain (FDTD) solver i
 s employed for\nhydrostatic stress simulation for both nucleation and post
 -voiding\nphases. Thermal migration effect is also considered in that solv
 er.\nA compact TSV thermal solver is employed for temperature distri-\nbut
 ion simulation and thermal dependent current simulation. The\nFDTD EM solv
 er and TSV thermal solver are coupled together at\neach time step so that 
 the interaction among EM stress, thermal\nstress, void growth, resistance 
 change, IR drop and joule heating\neffects can be simulated in a single si
 mulation framework. Accuracy\nof the proposed tool is validated with comme
 rcial finite element\n(FEM) tool and published experiment data. Comparison
  results\nshow that the proposed method has high accuracy and fast sim-\nu
 lation speed. EMChiplet get 10 times speed up compared with\ncommercial FE
 M tool and only have 2% of accuracy trade off.\nFurthermore, comparednd wi
 th experiment result the average error\nis less then 5%\n\nTopics: EDA\n\n
 Tracks: EDA8: Design for Manufacturing and Reliability\n\nSession Chairs: 
 Qi Sun (Zhejiang University) and Ing-Chao Lin (National Cheng Kung Univers
 ity)\n\n
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