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DTSTART:19700308T020000
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DTSTAMP:20260402T024534Z
LOCATION:2008\, Level 2
DTSTART;TZID=America/Los_Angeles:20250623T163000
DTEND;TZID=America/Los_Angeles:20250623T164500
UID:dac_DAC 2025_sess215_ENGPRES262@linklings.com
SUMMARY:Accurate Thermal Simulation of 3DIC Package with Co-Packaged Optic
 s
DESCRIPTION:Ahsan Alam, Qinglian Li, Lucy Yin, Lang Lin, and Wenbo Xia (An
 sys)\n\nCo-packaged optics (CPO) is a promising candidate for implementing
  low-power, high-bandwidth optical links in datacenters and in high-perfor
 mance computing (HPC) systems. By bringing the optical transceiver into th
 e 3DIC package, CPO can reduce the complexity and power loss of the overal
 l system.  These benefits come at the cost of increased thermal power dens
 ity in the 3DIC from the tighter integration. The close proximity of the e
 lectrical integrated circuit (EIC) and the photonic integrated circuit (PI
 C) also results in thermal cross-talk through vertical die-to-die coupling
 . Accurate thermal simulation of the 3DIC package is needed to ensure ther
 mal integrity of the package and to reduce performance degradation from th
 ermal crosstalk. In this work, we demonstrate a highly efficient and accur
 ate chip-centric thermal simulation workflow for CPO.  By generating chip 
 thermal models (CTMs) for the EIC and PIC, we enable efficient thermal sim
 ulation of the 3DIC package to profile the high-fidelity temperature distr
 ibution of all dies. We extend the traditional CTM for modelling the PIC w
 hich increases the overall accuracy of our simulation. The temperature map
  is imported into a photonic circuit simulator to capture the effects of t
 hermal crosstalk from the package on the performance of the PIC.\n\nTopics
 : AI, Systems and Software, Chiplet\n\nSession Chair: Frank Schirrmeister 
 (Synopsys)\n\n
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