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DTSTAMP:20260402T024532Z
LOCATION:2008\, Level 2
DTSTART;TZID=America/Los_Angeles:20250623T164500
DTEND;TZID=America/Los_Angeles:20250623T170000
UID:dac_DAC 2025_sess215_ENGPRES358@linklings.com
SUMMARY:High Performance Extraction of 2.5D/3D-IC Package
DESCRIPTION:Xiaoyan Xiong, Yingxin Sun, Jiyue Zhu, Gang Kang, and Jian Liu
  (Cadence Design Systems, Inc.)\n\nThe need for modern workloads in the la
 test innovations has brought 2.5D/3D stacking and advanced IC packaging te
 chnologies to the forefront. The requirements for integrating multiple chi
 ps, components, and materials to create an advanced IC package are becomin
 g increasingly complicated and introduce new challenges to existing extrac
 tion and analysis methods. Fast and accurate extraction and analysis metho
 ds are increasingly critical for complex advanced IC package design. We de
 veloped a hybrid computational electromagnetic framework, utilizing differ
 ent basic electromagnetic methods for modeling different parts of the pack
 age, and leveraging the machine learning models that greatly simplified th
 e extraction complexity, to extract advanced IC packages efficiently and a
 ccurately. It has the capability to do the extraction of entire IC package
  within reasonably short time frames. It can generate various netlists mod
 els with standard die to package, and to board mapping headers, for system
 -level analysis and validation. With high efficiency and reliability, the 
 developed solver helps designers to meet compressed schedules of IC packag
 e design.\n\nTopics: AI, Systems and Software, Chiplet\n\nSession Chair: F
 rank Schirrmeister (Synopsys)\n\n
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