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BEGIN:VEVENT
DTSTAMP:20260402T024534Z
LOCATION:2012\, Level 2
DTSTART;TZID=America/Los_Angeles:20250624T141500
DTEND;TZID=America/Los_Angeles:20250624T143000
UID:dac_DAC 2025_sess225_ENGPRES027@linklings.com
SUMMARY:Efficient Automation Strategy for Package Substrate Routing
DESCRIPTION:Keng Tuan Chang, Chih Yi Huang, Chen Chao Wang, and Chin Pin H
 ung (Advanced Semiconductor Engineering, Inc.) and Woei Haur Hung and Ting
 -Chi Wang (National Tsing Hua University)\n\nThe existing automatic routin
 g tools often produce design rule violations and fail to meet the required
  routing completion rate when dealing with the complex electrical connecti
 on and constraints. In this work, an algorithm of determining auxiliary po
 int is introduced to guide the auto-routing tool to generate a preliminary
  layout for FCBGA substrate, and then the preliminary layout is optimized 
 by Residual Neural Network and Decision Transformer model. The auxiliary p
 oint corresponding to die pad is disposed in proximity to the die edge and
  its coordinate is determined by the corresponding die pad coordinate, sig
 nal type and design rules, such as the minimum trace width and spacing. Ex
 perimental results demonstrate the proposed method effectively achieves hi
 gh routing completion rate and enhances layout defects including detour an
 d dense routing.\n\nTopics: AI, Back-End Design\n\nSession Chair: Patricia
  Fong (Marvell Semiconductor)\n\n
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