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DTSTART:19700308T020000
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DTSTART:19701101T020000
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BEGIN:VEVENT
DTSTAMP:20260402T024533Z
LOCATION:2012\, Level 2
DTSTART;TZID=America/Los_Angeles:20250624T164200
DTEND;TZID=America/Los_Angeles:20250624T170000
UID:dac_DAC 2025_sess226_ENGPRES196@linklings.com
SUMMARY:A Simulation Technique of Thermal Side-Channels from Cryptographic
  Circuits
DESCRIPTION:Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaaki Okidono, 
 Takuji Miki, and Makoto Nagata (Kobe University)\n\nThis study investigate
 s the potential risks of thermal side-channel leakage in cryptographic cir
 cuits. Unlike current-based side-channel attacks, thermal energy presents 
 unique challenges due to its inherent difficulty to confine. Cryptographic
  operations generate thermal energy as a byproduct, which can leak sensiti
 ve information. Using a novel simulation technique, we combined circuit si
 mulation and thermal analysis to evaluate temperature variations during AE
 S operations. Our findings reveal that plaintext-dependent temperature dif
 ferences, with T-values exceeding 4.5 in some cases, indicate a potential 
 for thermal leakage.\n\nTo mitigate this, heat dissipation mechanisms were
  evaluated. While these mechanisms reduced temperature variations on the c
 ircuit side, new leakage pathways emerged in other areas, demonstrating a 
 trade-off between thermal management and security. This highlights the nee
 d for balanced design strategies that address both thermal behavior and cr
 yptographic robustness.\n\nOverall, this stu\n\nTopics: Back-End Design, C
 hiplet\n\nSession Chair: Amol Joshi (Intel Corporation)\n\n
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