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DTSTAMP:20260402T024533Z
LOCATION:3012\, Level 3
DTSTART;TZID=America/Los_Angeles:20250624T103000
DTEND;TZID=America/Los_Angeles:20250624T120000
UID:dac_DAC 2025_sess241_PANEL009@linklings.com
SUMMARY:Beyond Limits: Packaging, Cryogenic, and New Cooling Strategies fo
 r Future Computing
DESCRIPTION:Subhasish Mitra (Stanford University); Mohamed Sabry Aly (Nany
 ang Technological University); David Atienza (ESL/EPFL); Mircea Stan (Univ
 ersity of Virginia); Jamil Kawa (Independent); Srabanti Chowdhury (Stanfor
 d University); Albert Zeng (Cadence Design Systems, Inc.); and John Wilson
  (Nvidia)\n\nAs computing systems push toward ever-increasing performance,
  thermal management becomes a fundamental bottleneck. Cooling is no longer
  just a support function—it is a necessity to ensure that modern and futur
 e computing architectures achieve their full potential. The question remai
 ns: what is the best approach to keep computing efficient while overcoming
  thermal constraints? Should we rely on conventional package-level cooling
 , embed advanced and exotic cooling solutions within the 3D stack itself, 
 or shift our focus toward developing thermally resilient devices that can 
 operate at much higher temperatures? This panel will explore these three p
 rimary thermal management strategies. We will bring together experts from 
 semiconductor manufacturing, system architecture, and thermal engineering 
 to debate the merits, feasibility, and trade-offs of each approach. While 
 cryogenic cooling remains an interesting avenue, the discussion will focus
  on the dominant and most practical cooling methods that can be broadly ap
 plied to computing systems today.\n\nTopics: Systems\n\n
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