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DTSTAMP:20260402T024532Z
LOCATION:3010\, Level 3
DTSTART;TZID=America/Los_Angeles:20250624T163000
DTEND;TZID=America/Los_Angeles:20250624T170000
UID:dac_DAC 2025_sess259_SSSN047@linklings.com
SUMMARY:AMD InstinctTM MI300 Series Accelerator: Engineering Showcase of H
 eterogeneous Integration Technologies
DESCRIPTION:Wonjun Jung (Advanced Micro Devices (AMD))\n\nCompute requirem
 ents for machine learning (ML) models for AI training and inference applic
 ations are driving the AI supercycle. Heterogeneous integration via chiple
 t architectures is key to enabling economically feasible growth of power-e
 fficient computing, particularly given the slowdown in Moore's law. AMD In
 stinct™ MI300 Series accelerators leverage multiple advanced packaging tec
 hnologies to provide a heterogeneous integration solution for emerging AI/
 ML and high-performance computing (HPC) workloads.\nIn this presentation, 
 we will highlight innovative advanced packaging technologies that directly
  enable the heterogeneous integration of multiple chiplets for AMD Instinc
 t™ MI300. These technologies include microbump 3D memory stacks, 2.5D sili
 con interposers, and 3D hybrid bonding. The combination of these advanced 
 packaging techniques facilitates architectural innovations and delivers ge
 nerational performance uplifts that traditional technologies and Moore's L
 aw scaling alone cannot achieve.\n\nTopics: Design\n\nSession Chair: Yu Ca
 o (University of Minnesota)\n\n
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