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DTSTAMP:20260402T024533Z
LOCATION:Level 2 Lobby
DTSTART;TZID=America/Los_Angeles:20250623T180000
DTEND;TZID=America/Los_Angeles:20250623T190000
UID:dac_DAC 2025_sess287_LBR118@linklings.com
SUMMARY:Late Breaking Results: Warpage-Aware Generative Floorplanning for 
 Reliable Advanced Packaging
DESCRIPTION:Min-Hung Chen, Cheng-Yen Li, Chuan-Chi Su, and Yao-Wen Chang (
 National Taiwan University) and Tung-Chieh Chen (Synopsys)\n\nThis paper p
 resents the first warpage-aware generative learning-based floorplanning al
 gorithm to effectively model the warpage effect and optimize the die floor
 plan on a fixed outlined substrate. With more heterogeneous materials and 
 dense interconnects in advanced packaging, warpage is a main reliability c
 oncern and may degrade system performance. We present a novel transformer-
 based encoding scheme to learn node and edge representations, followed by 
 parallel decoding and warpage-aware legalization to jointly minimize die d
 isplacement and warpage. Experimental results show that our algorithm impr
 oves warpage by 9.9% and wirelength by 8.3% on average, compared with the 
 state-of-the-art work.\n\n
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